Conference

Conferences

Access to scientific and technical information is a priority in terms of innovation and technological advances. It must enable you to implement the latest techniques in order to offer the best services in NDE.

The scientific programme composed of presentations given by expert speakers will enable the participants to debate on:

  • New industrial applications of NDE
  • Feedback from industrialists’ experience
  • Research and Development Works

Doctorands’ poster sessions will give scientists the opportunity to present and interchange on the subject of their thesis.

Also scientific plenary presentations will complete the conference program.

CALL FOR PAPERS: Deadline 15 NOVEMBER 2019

COFREND launches the Call for Papers to be presented during the 2020’s edition of the COFREND Days, from May 12th to 14th, at Palais Chanot Conferences and Events center in Marseille.
Under the theme “NDT, See to Foresee”, for quality and security, these conferences will provide an overview of the most recent advances in the field of Non Destructive Testing.

TWO KINDS OF COMMUNICATION ARE PROPOSED:

  • Technical Sessions: Conferences (20 minutes oral presentations, including 5 min for Questions & Answers).

NEW: an international session will be organized, with english being the only language

  • 4th Edition of COFREND’s DOCTORIALES: Posters and pitches of 180 seconds for the COFREND-Claude BIRAC Award
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SUMMARY

Summary of the proposed conference paper (3500 Characters or 400 words)


Remaining characters: 3500

TOPICS

Alternatives to historical methodsRobotics assisted NDEHeterogeneous materials (composites, concrete.)Monitoring of structures (SHM)New imaging techniquesNDE of adhesive bondingNDE in additive manufacturingData analysis and diagnosisDemonstration of performances and Probability of Detection (POD)NDE for renewable energyDigitisationMaterials characterisationMachine Learning & Artificial IntelligenceInverse methods & defects characterisationNew technics

SECTORS

AerospaceAutomotiveSteel worksShipbuildingEnergy & EnvironmentRailwayCastingCivil EngineeringMechanics, metallurgy, ironOil, gas, chemistry

METHODS

Electromagnetic MethodsAcoustic MethodsEmerging MethodsOptical MethodsThermal MethodsGuided WavesRadiography & TomographySurface MethodsTeraHertzUltrasonicsPhased Array Ultrasonics

CONTENTS

Industrial ApplicationsCertification & TrainingEquipment & probesStandardisationQualificationSimulationFundamental WorksPhysics

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TIMELINE

  • Call for papers : 18 July 2019
  • Deadline for abstract submission : 15 November 2019
  • Final programme : January 2020
  • Deadline for full papers: March 31st, 2020
  • Registration : Avril 30th, 2020

FEES

Rates are for the 3 days including all conference activities, exhibition, coffee breaks, lunches and Gala Dinner.

COFREND Members

  • Presenting Authors : 575 € Excl.VAT (690 € Tax incl.)
  • Doctorands : 450 € Excl.VAT (540 € Tax incl.)
  • Professionals before March 31, 2020 : 625 € Excl.VAT (750 € Tax incl.)
  • Professionnals from April 1, 2020 : 750 € Exl.VAT (900 € Tax incl.)

COFREND non Members

  • Presenting Authors : 750 € Excl.VAT (900 € Tax incl.)
  • Doctorands : 450 € Excl.VAT (540 € Tax incl.)
  • Professionals before March 31, 2020 : 800 € Excl.VAT (960 € Tax incl.)
  • Professionnals from April 1, 2020 : 950 € Exl.VAT (1140 € Tax incl.)

SCIENTIFIC COMMITTEE
President : Pierre CALMON, President of COFREND’s Scientific HubMembers :

  • Odile ABRAHAM – IFSTTAR
  • Mourad BENTAHAR – Université du Maine
  • Florence BEY – SNCF
  • Bernard BISIAUX – COFREND
  • Claude CHAMBON – Aubert et Duval
  • Bastien CHAPUIS – CEA List
  • Bertrand CHASSIGNOLE – EDF
  • Daniel CHAUVEAU – Institut de Soudure
  • Marc DESCHAMPS – Université de Bordeaux
  • Nicolas DOMINGUEZ – Airbus Groupe
  • Frédéric JENSON – SAFRAN Tech
  • Valérie KAFTANDJIAN – INSA Lyon
  • Jean Claude LENAIN – COFREND
  • Robert LÉVY – COFREND
  • Joseph MOYSAN – Université Aix-Marseille
  • Mireille RAPIN – Framatome Intercontrôle
  • Hervé TRETOUT – COFREND
  • Henri WALASZEK – CETIM

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